Molded Interconnect Device Market Booming at high CAGR of 13.2 % by 2027

Posted by peeterdbmr on April 9th, 2021

Molded interconnect device market is expected to reach USD 2.71 billion by 2027 witnessing market growth at a rate of 13.2% in the forecast period of 2020 to 2027. Molded interconnected devices refer to devices interconnected to or molded with circuits to perform functions other than the devices primarily made for.

Major Market Competitors/Players: Global Molded Interconnect Device Market

Some of the major players operating in the global molded interconnect device market are MacDermind Inc., Molex Llc, LPKF, TE Connectivity, HARTING Technology Group, Arlington Plating Company, Johnan America Inc., MID Solutions GmbH, LaserMicronics, Yomura, TactoTek Corporation, DowDuPont (The Dow Chemical Company, DuPont), Multiple Dimensions AG, Galtronics USA ltd., Teprosa GmbH, Cicor Management AG, 2E Mechatronic, RTP Company, TONGDA Group, and S2P Smart Plastic Products S2P among others.

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For instance, the calling feature in the steering wheel, the function is made available by interconnecting systems of a headset and subsequent circuits being molded in the steering wheel of the car. With continuous innovation and desire for new technology, the number of patents in molded interconnect devices (MID) has seen a two fold increase since 2010.

Market Segmentation: Global Molded Interconnect Device Market

•          The global molded interconnect device market is segmented based on product type, process type, end users, and geographical segments.
•          Based on the product, the market is further segmented into antennae and connectivity modules, sensors, connectors and switches, lighting and others.
•          Based on process, the market is further segmented into laser direct structuring, two-shot molding, others.
•          Based on end users, the market is further segmented into automotive, consumer products, healthcare, industrial, military and aerospace, telecommunication and computing, and others.

Competitive Analysis: Global Molded Interconnect Device Market

The global molded interconnect device market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of global molded interconnect device market for global, Europe, North America, Asia Pacific and South America.