The role of LED heat sink

Posted by Mingfatech on May 15th, 2018

The LED heat sink can be used to control the junction temperature and less than the maximum junction temperature of the semiconductor device. LED heat sinks are mostly chosen for materials with high thermal conductivity. Currently, LED radiators used in domestic and foreign electronic complete products are generally made of copper, aluminum, and iron. The most used aluminum is (thermal conductivity 2.12 W/cm·°C). Copper has a high thermal conductivity (3.85 W/cm·°C), but the cost of non-aluminum is low. In some small electronic products, some of them use a heat sink made of steel, although the heat transfer of steel The conductivity is a little worse (0.46 W/cm·°C), but its cost is relatively low, so that it can be used in products that are not very demanding. In most cases, the thicker the material of the LED heat sink and the larger the surface area, the better the heat dissipation effect, but in the case that the actual temperature of the semiconductor power device can be guaranteed to be less than the maximum junction temperature in the normal operating state, Then we should use as little as possible of the volume of material

The heat sink is used to control the junction temperature of the semiconductor device less than the maximum junction temperature. Radiators are generally made of materials with high thermal conductivity. At present, the materials used for heat sinks in electronic complete products are generally aluminum, copper, and iron. The most widely used is aluminum (thermal conductivity 2.12W/cm · °C). Copper has a high thermal conductivity (3.85 W/cm·°C), but not as low as aluminum. In some small electronic products, some use a heat sink made of steel, although the thermal conductivity of the steel is poor (0.46 W /cm·

°C), but its low cost can be used in less demanding products. Under normal circumstances, the thicker and larger surface area of ​​the heat sink, the better the heat dissipation effect. However, in the case that the actual junction temperature of the semiconductor power device can be guaranteed to be lower than the maximum junction temperature in the normal operating state, a smaller size and less material should be selected.