Huahong Semiconductor's third generation 90nm embedded flash process platform ma

Posted by Pansy Chan on June 28th, 2019

Hua Hong Semiconductor Co., Ltd. ("Huahong Semiconductor") announced that its third-generation 90-nm embedded flash (90nm eFlash) process platform has been successfully mass-produced.

Hua Hong Semiconductor has been deeply immersed in the field of embedded non-volatile memory technology. Through continuous technological innovation, the Flash cell size of the third-generation 90-nm embedded flash memory technology platform is reduced by nearly 40% compared with the second-generation process, creating a global wafer. The smallest size record for the foundry's 90nm process node embedded flash technology. Flash IP has a more obvious area advantage, which further reduces the overall chip area, thus obtaining more bare chips on a single wafer. At the same time, the number of mask layers is further reduced, effectively reducing the cycle time.

The reliability index continues to maintain a high level of 100,000 erasing and 25 years of data retention. In recent years, Hua Hong Semiconductor has successfully launched three generations of flash memory technology platforms at the 90-nm process node, and constantly seeks a more cost-effective solution while maintaining its technological advantages. The large-scale stable mass production of the third-generation process platform provides continuous and stable support and solutions for diversified products such as smart cards and security chip products such as telecom cards, Ukey, and transportation cards, and microcontrollers (MCUs).

Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor, said: "Huahong Semiconductor is the leader in embedded non-volatile memory technology. In the future, it will continue to focus on R&D and innovation of 200mm differentiated technology for high-density smart cards and high-end microcontrollers. At the same time, we are constantly striving to provide significant optimization in power consumption and area, extending the existing technical advantage of 200mm to 300mm, and better serving domestic and foreign semiconductor chip design companies to meet market demand."