Global Semiconductor Wafer Polishing and Grinding Equipment Market Size, Share,Posted by Rashi Pande on November 28th, 2019 Market Analysis: Global Semiconductor Wafer Polishing and Grinding Equipment MarketGlobal semiconductor wafer polishing and grinding equipment market is set to witness a substantial CAGR of 7.45% in the forecast period of 2019-2026. The report contains data of the base year 2018, historic year 2017. Increasing consumption of consumer electronics and rising outsourcing activities is another factor for the growth of this market. Market Definition: Global Semiconductor Wafer Polishing and Grinding Equipment MarketWafer is a thin piece of a semiconductor which is usually made of crystalline silicon which is mainly used as a base for the silicon based photovoltaic cell and to fabricate electronic integrated circuits. Today, thin wafers are more in demand as electronics are getting smaller and smaller with time. Grinding machine as the name suggest is a machine which is used for grinder. Belt grinder, cylindrical grinder, surface grinder, and bench grinder are some of the common type of grinder. Increasing usage of electronic device is the factor fuelling the growth of this market. Market Drivers:
Market Restraints:
Segmentation: Global Semiconductor Wafer Polishing and Grinding Equipment MarketBy Equipment
By End- Users
By Geography
Get TOC of Full Report: https://www.databridgemarketresearch.com/toc/?dbmr=global-semiconductor-wafer-polishing-and-grinding-equipment-market Key Developments in the Market:
Competitive Analysis Global semiconductor wafer polishing and grinding equipment market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of semiconductor wafer polishing and grinding equipment market for Global, Europe, North America, Asia-Pacific, South America and Middle East & Africa. Major Market Competitors/Players Few of the major competitors currently working in the global semiconductor wafer polishing and grinding equipment market are Applied Materials, Inc., EBARA CORPORATION, Lapmaster, Entrepix, Inc., Revasum., TOKYO SEIMITSU CO., LTD, Logomatic GmbH, Komatsu NTC, OKAMOTO CORPORATION, Amtech Systems, Inc., BBS KINMEI CO.,LTD., DYMEK Company Ltd., Dynavest Pte Ltd., FUJIKOSHI MACHINERY CORP., G&N Genauigkeits Maschinenbau Nürnberg GmbH, Gigamat Technologies, Hunan Yujing Machinery Co., Ltd., Meyer Burger Technology AG, Speedfam (I) Pvt. Ltd., among others. Like it? Share it!More by this author |