Semiconductor Wafer Fab Equipment Market - Increasing Technological Advancements

Semiconductor wafer fabrication involves sequential steps of chemical and photolithographic processes which create a semiconductor device. Semiconductor device fabrication involves four steps which include processes ranging from deposition, removal to modification of electrical properties. Silicon is used to make wafers while fabrication is done.

 

Silicon is melted, purified, and cooled to form an “ingot” which is further cut into wafers. To ensure the quality of semiconductor wafer fabrication equipment, a wafer test is done to monitor damages caused to the wafer. It helps in analyzing whether the processing can continue or not. 

 

Factors such as growing demand from consumer electronics industry, and increasing technological advancements in telecom and semiconductor sector are expected to drive the demand for semiconductor wafer fab equipment market during the forecast period. Other factors such as demand for silicon wafer, equipment footprint would help in analyzing semiconductor wafer fab equipment market in future.

 

Moreover, innovation in wafer technologies which have led to “denser packaging” of devices such as MEMS (micro-electro-mechanical system) and transistors are expected to create foundation for new opportunities which can be leveraged by companies.

 

 

Semiconductor wafer fab equipment market is segmented on the basis of wafer fabrication process, application, wafer size, and end-user. Further classification of wafer fabrication processing includes FEOL (front-end-of-line) processing, and BOEL (back-end-of-line) processing. FEOL processing is the prime stage of IC fabrication in which devices such as capacitors, and resistors, among others are amalgamated in the circuit.

 

BEOL is the second phase of fabrication which interconnects devices on the wafer with wiring. Based on end-user the segment is classified as telecom, retail, healthcare, and banking and financial services, among others. According to the wafer size, classification includes wafers sizes such as 150 mm, 200 mm, and 300 mm. Semiconductor wafer fab equipment have varied applications for consumer audio/video and entertainment products, smart phone, television, pagers, PC peripherals, copiers, and automotive parts.