Apply a water soluble paste flux using a syringe and apply a ball of the device with a gloved finger. Remove the solder ball using the appropriate blade tip or temperature setting based on the solder ball alloy. Use a soft-solder to ensure that the pad is flat and remove any remaining solder. Move the blade up and down without sweeping the bottom of the part to scratch the mask or lift the pad of the part.
Step 2: Clean Deball part
Remove flux residue from the bottom of the Devar section using isopropyl alcohol and a non-electrostatic induction wipe to clean the Deball part
Step 3: Apply water soluable paste flux
Examine the device to make sure that the mask or lift pad is not scratched on the bottom of the device. Apply water soluble paste flux to the bottom of the part. Spread with a soft brush until the uniform thickness is at the bottom of the part.
Step 4: Place the preform ball on top
Place the preform ball on top of a flat heat-resistant surface, such as a flat ceramic plate. Make sure that the preforms are aligned with the device pattern. Make sure you have the correct solder alloy solder ball attached to the device.
Step 5: Carefully place the device on top of the preform
Carefully place the device on top of the BGA recall preform, making sure that the orientation of the pattern is correct.
Step 6: Square up the device to the preform
Use square brackets or other measures to "square" the preform to a BGA
Step 7: Reflux
Place the "sandwich" structure of the preform and equipment into a Reflux oven or other heat source. Make sure that the proper temperature setting is made.
Step 8: Wipe out Preform
While still warm, remove the preform from the device. Make sure that all balls have moved to the device. Please wipe with water and a soft brush. Re-inspect the scratches on the mask or lifted pad.
Step 9: Check Reballed equipment
Examine the reballed device by expanding it to the criteria you have in mind.
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